PENINGKATAN KUALITAS MELALUI IMPLEMENTASI FILOSOFI SIX SIGMA (Studi Kasus di sebuah Perusahaan Speaker)

Authors

  • Jani Rahardjo Faculty of Industrial Technology, Petra Christian University
  • Debora Anne Yang Aysia Faculty of Industrial Technology, Petra Christian University
  • Susan Anitasari Alumnus, Faculty of Industrial Technology, Petra Christian University

DOI:

https://doi.org/10.9744/jti.5.2.101-110

Abstract

The article describes the quality improvement program in a speaker company%2C through the implementation of six sigma philosophy; design a quality control system to support the result of the philosophy implementation%2C helped by the house of quality. The improvement of the quality level to 6ƒã is done by knowing the speaker¡¦s critical to quality (CTQ). The CTQ improved by minimized the highest defect. There are an analysis to six sigma indicator and the quality cost. The result is a quality improvement through the two type of speaker%2C 12¡¨ C-1230 PA ACR Pro New and 12¡¨ 30H120 SRW-38B ACR Pro New.
Abstract in Bahasa Indonesia :

Artikel ini membahas program peningkatan kualitas di sebuah perusahaan speaker melalui implementasi filosofi six sigma%2C perancangan perbaikan sistem pengendalian kualitas guna mendukung hasil implementasi%2C dengan bantuan rumah mutu. Peningkatan level kualitas ke arah 6ƒã dilakukan dengan mengetahui karakteritik kritis konsumen terhadap produk speaker%2C yang kemudian diperbaiki dengan meminimalkan kecacatan tertinggi. Analisa dilakukan terhadap indikator keberhasilan six sigma dan biaya kualitas. Perbandingan indikator keberhasilan menyatakan adanya peningkatan kualitas terhadap kedua tipe speaker yaitu 12¡¨ C-1230 PA ACR Pro New dan 12¡¨ 30H120 SRW-38B ACR Pro New. Six sigma%2C house of quality%2C critical to quality%2C quality cost.

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Published

2004-07-13

How to Cite

[1]
J. Rahardjo, D. A. Y. Aysia, and S. Anitasari, “PENINGKATAN KUALITAS MELALUI IMPLEMENTASI FILOSOFI SIX SIGMA (Studi Kasus di sebuah Perusahaan Speaker)”, J. Tek. Ind. J. Keilmuan dan Apl. Tek. Ind., vol. 5, no. 2, pp. 101–110, Jul. 2004.

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